Friedbert Klefenz, president of Bosch Packaging Technology, said, “2013 was a very successful year for Bosch. We generated sales of 1.1 billion euros. This figure was some 200 million euros higher than our 2012 sales. After adjusting for consolidation effects, we achieved 6.4% growth. Without adjusting for currency effects, our sales were 10% higher than the previous year.”

In 2013, Bosch generated almost 40% of its sales in Europe, compared with 30% in Asia, which it expects will reach to 37% by 2020.

Speaking to PrintWeek India about its Indian operations, Klefenz said, “The Indian market has stagnated since the 2008 economic crises. We have plans in store for India, however, certain decisions will depend on the results of general elections are declared.”

During the press conference, Dr Stefan Konig, executive vice president engineering and manufacturing, Bosch spoke about product highlights at Interpack. He said, “From a technical point of view, there are two main areas of focus: flexibility and product safety. Both are becoming increasingly important for our customers, and thus also for us.”

At Interpack, Bosch introduced its Module++ technology. Konig said, “With this concept, we offer maximum flexibility at an attractive price. Customers select standard machinery that is then adjusted to meet their specific needs. From additional single units to automation and entire lines, Module++ covers a broad range of applications.”

Besides Module++, the company unveiled various new concepts such as a high-performance packaging system for biscuits Blo linear blowing machine for PET containers and the FXS Combi for filling and sealing of nested syringes, vials, and cartridges among others.