CII to host Packaging Expo and Conference from 18-25 May
The Confederation of the Indian Industry (CII) is set to host an online exhibition and knowledge-sharing forum — Packaging Expo and Conference — from 18 to 25 May 2021.
15 May 2021 | 1930 Views | By WhatPackaging? Team
According to the organiser, this event intends to transform the packaging sector by enabling the exchange of ideas, fostering dialogues and creating strong linkages. It is set to cover varied aspects of the packaging ecosystem such as the need and impact of the anti-dumping regulations and tariff barriers on imports and processing, sustainability and innovations in recycling among other topics.
“With Breaking Barriers, Bridging Gaps as its central theme, the conference is slated to cover concepts that focus on a broad spectrum of opportunities, challenges and best practices. The event will enable the leaders to engage in discussions that promote inclusive growth,” said a press note shared with WhatPackaging?.
It added, “It will also create a dynamic, reliable and conducive platform for the convergence of all the stakeholders to forge the strategies for the inclusive growth. And bring together the best in the packaging sector.”
The event will be conducted on the organisation’s in-house platform, CII Hive under the chairmanship of Piruz Khambatta, chairman and managing director, Rasna. The Expo and Conference is supported by Tinplate Corporation of India, Aquachill, Sigma Capseal, EPL, Electronics Devices, UFlex, Indian Institute of Packaging (IIP) and Plastics Machinery Manufacturers Association of India.
Click here to register for the eight-day event.
The speakers for the Packaging Expo and Conference
B Thiagarajan, chairman CII western region
Piruz Khambatta, chairman and managing director, Rasna
Sudhanshu Vats, MD and CEO, Essel Propack,
Ashutosh Manohar, MD South Asia market, Tetrapak
Dr Tanveer Alam, director, Indian Institute of Packaging,
Sudip Mall, MD, Huhtamaki India
Saket Kanoria, MD, TCPL Packaging
RN Murthy, MD, Tinplate Company of India
Jeevaraj Pillai, joint president, UFlex
Andreas Phil, executive vice president-R&D / technology portfolio, Nefab
MP Singh, IFS, director, Institute of Wood Science and Technology
Neelam Lalwani, global head – quality, ACG
Mahendra Patel, chairman, Mamata Machinery
Vivek Chinoy, MD, Sigma Capseal
Gajanan Khot, director, Aquachill
Manan Chopra, director, Benz Packaging
NLRaju, VP and GM, technology platform APAC and MEA, Signode
Prasad Balan Iyer, I/C director, SIES School of Packaging
Robin Banerjee, MD, Caprihans India
Shirish Divgi, COO, Feromatik Milacron