Engineering the future of embellishments at Labelexpo 2024

Kurz India is all set to present its range of advanced solutions in hot stamping, cold transfer, and digital finishing at Labelexpo 2024.

11 Nov 2024 | 704 Views | By PrintWeek Team

Kurz India is set to showcase the next generation of embellishment technologies at the much-anticipated Labelexpo 2024. Visitors at Booth G10 in Hall 10 will witness a range of advanced solutions in hot stamping, cold transfer, and digital finishing cementing its position as the one-stop solution provider in the industry. 

Kurz India’s commitment to innovation and sustainability is evident in its presentation of cutting-edge hot stamping, cold transfer, and digital printing solutions. 

Highlights include cold-transfer metallisation, vibrant colour effects, and haptic enhancements for industries like labels, covers, beverages, cosmetics and security. 

The new KPW slim solution, with a thin six-µm carrier, leads material-saving efforts, emphasising the brand’s eco-conscious approach.

Notable innovations include the Distorun 2.0 module, enabling the optimal use of transfer carriers, and Trustseal SFX technology for creating eye-catching 3D effects. 

On the security front, Kurz India will present counterfeit-proof label patterns, ensuring product safety with unique security features.

Visual demonstrations of the DM-Uniliner 2D and 3D machines on the screen will showcase the latest digital finishing capabilities, offering flexibility for pre- and post-print processes. 

Kurz India’s focus on sustainability shines through its reduced CO2 footprint, with thinner transfer products and minimised material consumption. 

The company’s innovations underline its leadership as a one-stop solution provider for embellishment and security needs.

Visit Kurz India at Labelexpo 2024 from 14 to 17 November at Booth G10 in Hall 10 to experience these groundbreaking technologies firsthand.
 

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