International summit for packaging industry opens from 27 October 2017

International summit for packaging industry (ISPI) will be hosting a two-day research conclave along with its main event focussing on business and technology.

Packaging raw materials, innovative solutions for growth, package printing and machinery are the subjects for the day one of the event focussing on business.

Day two will be highlighting the technological trends and advancements in the packaging industry which will comprise of subjects such as interactive packaging and its relevance, packaging of fresh and processed foods, packaging of pharmaceutical products, packaging of personal and healthcare products.

Research conclave which will be an ongoing parallel event with the ISPI event will consist of sessions on innovation, packaging research and technology, new generation packaging, recent developments in packaging.

The event, organised by Indian Institute of Packaging, is scheduled from 27-28 October 2017 at Hotel Eros, Nehru Place, New Delhi.