PackAge 2011 conference to discuss key issues of packaging industry
PackAge 2011, a conference on the latest packaging trends, will be held from 7-9 December 2011 in Okhla (New Delhi).
30 Nov 2011 | By Samir Lukka
The conference will be held in association with All India Food Processors Association (AIFPA) and the Automation Industries Association (AIA) at Hotel Crowne Plaza Today, Okhla.
The conference which will run parallel to the India Packaging Show exhibition key issues of packaging such as: bio-degradable polymers, nano-coated materials, hi-speed system packs, needs of convenience, compliance RFID and smart-packaging as well as sustainability and waste management.
The three-day conference will involve a series of technical sessions with leading Indian and international industrial experts such as Marc De Vries of Bosch, Vivek Chinoy of Electronic Devices, Harveer Sahani of Weldon Celloplast, Saket Bhatia of Hindustan Tin Works, Kishor Butani of Robatech India, N C Saha of Indian Institute of Packaging, among several others.
Every day of the conference would cater to a specific theme. While the first day of the conference would deal with emerging trends in packaging materials, systems and compliances, the second day would focus upon cutting edge technologies for food processing industries in India, and the third and final day would discuss the new automation systems available for packaging.
The registration for the conference is open. Interested registrants can visit http://www.indiapackagingshow.com.
The conference which will run parallel to the India Packaging Show exhibition key issues of packaging such as: bio-degradable polymers, nano-coated materials, hi-speed system packs, needs of convenience, compliance RFID and smart-packaging as well as sustainability and waste management.
The three-day conference will involve a series of technical sessions with leading Indian and international industrial experts such as Marc De Vries of Bosch, Vivek Chinoy of Electronic Devices, Harveer Sahani of Weldon Celloplast, Saket Bhatia of Hindustan Tin Works, Kishor Butani of Robatech India, N C Saha of Indian Institute of Packaging, among several others.
Every day of the conference would cater to a specific theme. While the first day of the conference would deal with emerging trends in packaging materials, systems and compliances, the second day would focus upon cutting edge technologies for food processing industries in India, and the third and final day would discuss the new automation systems available for packaging.
The registration for the conference is open. Interested registrants can visit http://www.indiapackagingshow.com.
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