PackPlus 2017 to host 375 exhibitors

PackPlus 2017 announced the participation of 375 exhibitors in their four day event to be held from 3 August to 6 August 2017 at Pragati Maidan, New Delhi.

26 Jun 2011 | By Sriraam Selvam

The exhibition would occupy six halls and for the first time an area of 16,000 sq mtr would introduce a special Packaging Product pavilion with products such as specialised anti-counterfeit solutions, the latest in honeycomb packaging etc., would be showcased.

The six halls would be segregated as Primary Packaging Machinery Hall, Supply Chain Hall and Converting Hall apart from hosting the Packaging Product pavilion.

The event is expected to see around 80 new product launching from Uflex Engineering, Modtech Machines, Bagla Group, MRL Printing Rolls and Skytech Corporation among others.

Other prominent exhibitors include HP India, Ishida India, Hassia Packaging, Parle Global, SSP Packaging, Shrink Packaging, G-Tech Packaging Solutions, Orpac Systems, etc.

“With various product launches, running machines and solutions on display, PackPlus 2017 is all set for a record breaking year” said Neetu Arora, president of Print-Packaging.com, the organisers of the show.