The half-day event will provide a platform where packaging enthusiasts will have space for reflection and an opportunity to discuss the latest trends. With the packaging industry eyeing the USD 43.7 bn mark, there is an increasing need for platforms where issues related to packaging can be addressed.
The Forum will commence with a packaging industry overview by PrintWeek’s team and a keynote presentation on packaging. Following which, there will be a presentation which will focus on Packaging Products Survey through a show-and-tell which will look at the use of Met-PET; lamination instead of foiling; offset-printed PP cartons; and cartons with overprinting on foil.
Bobst India, Manipal Technologies and QuadTech are the partners for the event. Each of them will bring the expertise in their respective field for the benefit of the participants.
The highlight of the Forum will be an open mike session; Behind the Brands. Here, packaging buyers representing various brands will touch upon technology trends. This session will witness at least 10-12 companies in India to share stories about how they create brands achieve greater and greater success.
The Behind the Brands session aims to inspire, showcase and educate – with each other.
The event will conclude with a Q&A round, wherein the partners will respond to the concerns raised by the packaging buyers. For example, the various innovations in packaging which is driven by brand owner’s need to reduce costs and improve product differentiation on shelf.
Attendance is strictly by invitation.
For further information and registration please contact: Noel D’Cunha - noel@haymarket.co.in or priya.raju@haymarket.co.in