Robatech’s new launches at Interpack

Among the launches are Platinum ECX6 and ECX30 heads, which boast of 1,000 cycles per minute and 500 cycles per minute, respectively.
 

Speaking to PrintWeek Inida, Jijesh Bhaskaran, manager - technical services, Robatech India, said, “The new electric cold glue application head ECX 6 Platinum combines the highest switching frequency for processing low viscosity dispersion adhesive, while ECX30 is suitable for processing medium viscosity adhesive.”

He further added, “With its no-contact adhesive application in dot or bead form, the cold glue application heads are suitable for use with folding machines, mailers and collators.”

The USP of these heads is that they are also available for PLC operation that means they can be controlled with OEM PLC panels eliminating the need to opt for controllers from Robatech thereby making the product cheaper.

Among the other highlights of the stand were AX Diamond heads for hotmelt application, Concept Diamond Series of adhesive melters, hand applicators, filling systems etc.
 

At Interpack, Robatech’s kit can be seen driving the glue units of converting and packaging machines at over 50 different stalls.