UFlex begins production of poly-condensed polyester chips in Panipat

In addition, the company announced the commissioning of a 6.5-m cast polypropylene (CPP) film line with an installed capacity of 18,000-mtpa in Russia through its subsidiary Flex Films Rus LLC, Russia.

UFlex’s polyester chips manufacturing plant has an impressive installed capacity of 168,000-mtpa and reaffirms the company’s commitment to expanding its vertical integration footprint. 

The Panipat plant will primarily manufacture poly-condensed polyester chips, which is a key raw material required to produce BOPET packaging films. In addition to catering to its in-house packaging film production, the facility will cater to third-party customers, contributing to the growth and sustainability of the packaging film industry in India. 

The Panipat facility complements the company’s packaging films India footprint in Noida,  and Dharwad, Karnataka, further solidifying UFlex’s presence and capabilities in serving its packaging film customers across the country.

The CPP packaging film line in Russia will complement the existing capacity of one 8.7-m BOPET film line with a capacity of 30,000-tpa and one 2.85-m plasma-enhanced avant-garde metalliser with a capacity of 8,000-tpa.

Ashok Chaturvedi, chairman and managing director, UFlex, said, “We are extremely buoyant about the commissioning of our polyester chips plant in Panipat, and the CPP line in Russia. Now more than ever, our customers are interested in reliability, speed, and quality in their supply chain, and this expansion will allow us to deliver on those expectations. We are relying on our vertical integration strategy to meet the ever-increasing demand of the packaging industry and are betting on new capacities, expanded global footprint, and the ability to deliver quality, innovation, and customised solutions that the industry expects from UFlex. Leveraging advanced technology and sustainable practices, the company remains dedicated to delivering superior products and solutions that address the dynamic needs of the packaging market.”